147Research on the application of 1-isobutyl-2-methylimidazole in sealant formulations
241Comparing the efficiency of different imidazole compounds as epoxy curing accelerators
239Application of 1-isobutyl-2-methylimidazole in waterborne epoxy resin systems
225Research on the role of 1-isobutyl-2-methylimidazole in high-temperature epoxy curing
199Analyzing the effect of 1-isobutyl-2-methylimidazole on the properties of cured epoxy resin products
185Application of 1-isobutyl-2-methylimidazole in electronic packaging epoxy resins
1961-Isobutyl-2-methylimidazole as a fast curing accelerator for epoxy resins
179Research on the application of 1-isobutyl-2-methylimidazole in polyurethane catalysis
210Performance evaluation of 1-isobutyl-2-methylimidazole as a metal corrosion inhibitor
156Analyzing the catalytic effect of 1-isobutyl-2-methylimidazole in organic synthesis reactions
129The effect of 1-isobutyl-2-methylimidazole on the bonding strength of epoxy adhesives
1434′-diaminodiphenylmethane as a curing agent on the performance of epoxy coatings
The effect of 4
1574′-diaminodiphenylmethane in electronic packaging materials
Exploring the application prospects of 4
1514′-diaminodiphenylmethane in the preparation of flame-retardant polymers
Analyzing the role of 4
1224′-diaminodiphenylmethane in thermosetting resin modification
Research on the application of 4
